+86-574-87459965

+86-18858061329

     
    HOME >> Dicing / Back Grinding >> Si Wafer Backgrinding
    CATEGORIES
    Products
    Si Wafer Backgrinding

    Si Wafer Backgrinding

    0.00
    0.00
      

    .

    • Diameter up to 300mm

    • Backgrinding thickness up to 50±5μm

    • Roughness after backgrinding around 100nm


    .

    .

    Request for Quote
    RELATED PRODUCTS