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Wafer Diameter
Thickness
Orientation
Type/Dopant
Resistivity
Finish
Flat
Thin film Material
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Thermal oxide (dry)
Thermal oxide (wet)
Epitaxy
PECVD oxide
PECVD nitride
PECVD SiC
LPCVD nitride
LPCVD low stress nitride
LPCVD poly (undope)
LPCVD poly (N/Phos doped)
LPCVD siC
Au
Cu
Ti
Ti/TiN
Cr
Mo
W
Al
Al/1% Si
Co/ 28%Al
Co/10% Fe
Fe
Ge
Ni
Pt
other materials
Film thickness
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