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    Wafer Resizing / Edge Rounding

    Wafer Resizing / Edge Rounding

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    Wafer Resizing / Coring Process

    A process that cuts larger-diameter wafers into smaller-sized wafers, primarily used for special dimension requirements, sample preparation, or low-volume production.


    Edge Rounding / Beveling Process
    A process that grinds and polishes wafer edges to remove chipping and microcracks generated during dicing, thereby improving the mechanical strength of wafers. It is typically performed as a subsequent step to the wafer resizing process.


    Laser Cutting Processing

           ➠Step1：Photoresist Spin Coating ➠Step2：Backgrinding  ➠Step3：Cleavage ➠ Step4：Wafer Resizing

           ➠Step5：Edge Rounding ➠Step6：Photoresist Removing



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