+86-574-87459965

+86-18858061329

    SERVICES
    Services
    Si Wafer Downsizing / Edge Grinding

    Si Wafer Downsizing / Edge Grinding

    0.00
    0.00
      


         Laser Cutting Processing

           ➠Step1:Photoresist Spin Coating ➠Step2:Backgrinding  ➠Step3:Cleavage ➠ Step4:Laser Cutting   

           ➠Step5:Edge Rounding  Step6:Photoresist Removing



    Prev: None
    Next: None