Growth	CZ, MCZ, FZ
Grade	Prime, Test, Dummy, etc.
Diameter	Other diameters,such as 10mm,12.7mm,1.5″,35mm,40mm,2.5″ are also possible
Thickness	50~3000um
Finish	As cut, lapped, etched,SSP,DSP, etc
Orientation	(100) (111)(110) (211)(311) (511)(531)  etc
Off cut	Up to 4 deg
Type/Dopant	P/B, N/Phos, N/As, N/Sb, Intrinsic
Resistivity	FZ : Up to 20k ohm-cm
	CZ/MCZ : From 0.001 to 150 ohm-cm
Thin films	* PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo,etc
	* PECVD: Oxide, Nitride, SiC,etc
	* Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc).
Processes	DSP, ultra thin, ultra flat, etc.
	Downsizing, back grinding, dicing , etc.
	MEMS