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    4 inch(100mm) Polished Wafer

    4 inch(100mm) Polished Wafer

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    Growth

    CZ, MCZ, FZ

    Grade

    Prime, Test, Dummy, etc.

    Diameter

    4 inch / 100mm

    Thickness

    50~3000um

    Finish

    As cut, lapped, etched,SSP,DSP, etc

    Orientation

    (100) (111)(110) (211)(311) (511)(531)  etc

    Off cut

    Up to 7 deg

    Type/Dopant

    P/B, N/Phos, N/As, N/Sb, Intrinsic

    Resistivity

    CZ/MCZ : From 0.001 to 1000 ohm-cm

    FZ : Up to 20k ohm-cm

    Thin films

    * PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo. etc, Coating thicknesses up to 20,000 Å / ± 5 %

    * LPCVD/PECVD: Oxide, Nitride, SiC, etc , Coating thicknesses up to 200,000 Å / ± 3 %

    * Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc)

    Processes

    DSP, ultra thin, ultra flat, etc.


    Downsizing, back grinding, dicing , etc.


    MEMS



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