Growth | CZ, MCZ, FZ |
Grade | Prime, Test, Dummy, etc. |
Diameter | 6 inch / 150mm |
Thickness | 200~3000um |
Finish | As cut, lapped, etched,SSP,DSP, etc |
Orientation | (100) (111)(110)(531) (553) etc |
Off cut | Up to 4 deg |
Type/Dopant | P/B, N/Phos, N/As, N/Sb, Intrinsic |
Resistivity | CZ/MCZ : From 0.001 to 1000 ohm-cm |
| FZ : Up to 20k ohm-cm |
Thin films | * PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo. etc, Coating thicknesses up to 20,000 Å / ± 5 % |
| * LPCVD/PECVD: Oxide, Nitride,SiC, etc , Coating thicknesses up to 200,000 Å / ± 3 % |
| * Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc) |
Processes | DSP, ultra thin, ultra flat, etc. |
| Downsizing, back grinding, dicing , etc. |
| MEMS |
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