Growth	CZ, MCZ, FZ
Grade	Prime, Test, Dummy, etc.
Diameter	12 inch / 300mm
Thickness	600~800um
Finish	As cut, lapped, DSP(300nm, 200nm,120nm, 90nm,65nm, 37nm), etc
Orientation	(100)   etc
Off cut	Up to 4 deg
Type/Dopant	P/B, N/Phos, N/As, N/Sb, Intrinsic
Resistivity	CZ/MCZ : From 0.001 to 200 ohm-cm
	FZ : Up to 5000 ohm-cm
Thin films	* PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo. etc, Coating thicknesses up to 20,000 Å / ± 5 %
	* LPCVD/PECVD: Oxide, Nitride, SiC, etc , Coating thicknesses up to 200,000 Å / ± 3 %
	* Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc)
Processes	DSP, ultra thin, ultra flat, etc.
	Downsizing, back grinding, dicing , etc.
	MEMS