Growth
| CZ, MCZ, FZ |
Grade
| Prime, Test, Dummy, etc. |
Diameter
| 12 inch / 300mm |
Thickness
| 600~800um |
Finish
| As cut, lapped, DSP(300nm, 200nm,120nm, 90nm,65nm, 37nm), etc |
Orientation
| (100) etc |
Off cut
| Up to 4 deg |
Type/Dopant
| P/B, N/Phos, N/As, N/Sb, Intrinsic |
Resistivity
| CZ/MCZ : From 0.001 to 200 ohm-cm |
| FZ : Up to 5000 ohm-cm |
Thin films
| * PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo. etc, Coating thicknesses up to 20,000 Å / ± 5 % |
| * LPCVD/PECVD: Oxide, Nitride, SiC, etc , Coating thicknesses up to 200,000 Å / ± 3 %
|
| * Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc)
|
Processes
| DSP, ultra thin, ultra flat, etc. |
| Downsizing, back grinding, dicing , etc. |
| MEMS |
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